Foxconn Electronics – FAB Building
Design a high-performance exterior envelope on a fast-track schedule
EUA partnered with Foxconn and design architect JJPan (Taiwan) on this high-tech office and manufacturing facility that is strategically located between Milwaukee and Chicago. As the technical expert and architect of record for the building envelope, we led an accelerated design and construction process that resulted in the exterior meeting Foxconn’s vision and remaining true to JJPan’s design.
The high-performance envelope protects the equipment and spaces from condensation and other forms of thermal stress. It is made up of precast and translucent panels, an advanced curtain wall, and insulated metal wall systems. The envelope, roof, and overall building structure exceed standard code requirements, protecting the interior from Wisconsin’s extreme changes in weather and wind conditions.
We also supported engineering and design firm Exyte (U.S.) in the development of Foxconn’s FAB building, their first U.S.-based manufacturing facility. The building features many production, support, and testing spaces, including humidified clean rooms for the manufacture of technology solutions that Foxconn delivers to its clients.
- New Construction
- Pleasant Prairie, WI
- 1M sq ft
- 60,000 sq ft office and customer demo space