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Foxconn Electronics – FAB Building

Design a high-performance exterior envelope in a fast track schedule

EUA was brought on to assist JJP and Exyte in creating Foxconn’s FAB Building, the first U.S. manufacturing facility for thin-film-transitor, liquid-crystal-display screens. EUA handled the design and detailing of the fabrication building’s exterior envelope.

To manufacture the screens, the facility uses specialized cleanrooms that are highly sensitive to moisture. The high-performance envelope wraps the building protecting the equipment and spaces from experiencing high-humidity or thermal stress. Materials used include precast and translucent panels, a curtain wall as well as insulated metal walls. The roof also was designed for high-performance protecting the interior spaces from all climates possibilities in Wisconsin.